Feedback control for heated TOSA

ABSTRACT

A closed loop system for controlling laser temperature without the need for additional sensors or other hardware. Embodiments utilize an existing automatic power feedback loop and existing sensors to determine the temperature of a TOSA based on changes in laser bias current, thus avoiding the need for the additional hardware. The automatic power feedback loop will modify the laser bias current as the temperature of the TOSA changes. That is, as the temperature increases, the amount of laser bias current is increased and as the temperature decreases, the amount of laser bias current is decreased. Thus, the laser bias current may be used as feedback for the laser temperature control. Accordingly, when the transceiver module drops below a predetermined temperature, a laser heater current may be controlled to thereby maintain the same laser bias current as at the preset temperature.

BACKGROUND

Lasers are commonly used in many modern components. One use that hasrecently become more common is the use of lasers in data networks.Lasers are used in many fiber optic communication systems to transmitdigital data on a network. In one exemplary configuration, a laser maybe modulated by digital data to produce an optical signal, includingperiods of light and dark output that represents a binary data stream.In actual practice, the lasers output a high optical output representingbinary highs and a lower power optical output representing binary lows.To obtain quick reaction time, the laser is constantly on, but variesfrom a high optical output to a lower optical output.

Optical networks have various advantages over other types of networkssuch as copper wire based networks. For example, many existing copperwire networks operate at near maximum possible data transmission ratesand at near maximum possible distances for copper wire technology. Onthe other hand, many existing optical networks exceed, both in datatransmission rate and distance, the maximums that are possible forcopper wire networks. That is, optical networks are able to reliablytransmit data at higher rates over further distances than is possiblewith copper wire networks.

Lasers typically have an optimal operating temperature range, which istypically around room temperature. For optimal performance of the laser,the laser temperature needs to be controlled to some range. Operationoutside of the temperature range can reduce the laser's performance tothe point it is unusable. For example, a decrease in performance of thelaser's turn-on time, turn-off time, optical modal properties andoptical power may be experienced. For semiconductor lasers such as aVCSELs, DFB lasers, or EMLs, the lasing mode is typically locked by thelaser feedback system, which may include, for example, DBR mirrors, orgratings. The gain, i.e., the amplification of the light, is provided bythe laser active region. Generally at cold temperatures, the laseractive region wavelength shifts to a shorter side, also known as a blueshift, due to semiconductor material properties. Therefore at coldtemperatures, the gain region peak wavelength may be significantlyshorter than the lasing wavelength. This may give rise to a host ofproblems for laser operation.

Illustratively, operation at colder temperatures may cause the laser'sreaction speed, the speed at which the laser changes from high poweroutput to low power output, to be decreased, thus lengthening thelaser's reaction time and reducing the communication bandwidth. Coldtemperatures may also cause a laser intended to operate in a single modefashion to operate in a multi-mode fashion. Cold operating temperaturesmay also reduce the amount of power that a laser can output. Despitethese limitations at these temperatures, there is increased demand forlaser modules that operate in wider temperature ranges and at colder andhotter temperatures.

The subject matter claimed herein is not limited to embodiments thatsolve any disadvantages or that operate only in environments such asthose described above. Rather, this background is only provided toillustrate one exemplary technology area where some embodimentsdescribed herein may be practiced.

BRIEF SUMMARY

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used as an aid in determining the scope of the claimed subjectmatter.

The principles of the present invention relate to an optical transceivermodule that includes a laser, a sensor configured to monitor an amountof laser bias current provided to the laser, a heating elementconfigured to heat the laser, and control circuitry coupled to theheating element and the sensor. The control circuitry is configured toadjust an amount of current provided to the heating element when thesensor determines that the laser bias current being provided to thelaser is below a predetermined value, the predetermined value beingindicative of a desired temperature. Providing current to the heatingelement causes an increase in the operating temperature of the laser.

The principles of the present invention also relate a method for anoptical transceiver to control the temperature of a laser. The methodincludes determining that a laser bias current provided to a laser isless than a predetermined value. The laser bias current is indicative oflaser temperature and the predetermined laser bias current value isindicative of a desired operating temperature. The method also includesadjusting an amount of current provided to a heating element configuredto heat the laser. The optical transceiver comprises a laser, a sensorconfigured to monitor an amount of laser bias current provided to thelaser, a heating element configured to heat the laser, and a controlmodule coupled to the heating element and the sensor.

The principles of the present invention further relate to an opticaltransceiver module that includes a laser, a sensor configured to monitoran amount of laser bias current provided to the laser, a heating elementconfigured to heat the laser, and control circuitry coupled to theheating element and the sensor. The optical transceiver is configured todetermine a relationship between the temperature of the laser and alaser bias current that is provided to the laser, determine that thelaser is not at a desired operating temperature based on a measuredlaser bias current value and the relationship between the temperature ofthe laser and laser bias current that is provided to the laser, andcause that a current to the heating element be provided or adjusted tothereby change the temperature of the laser until a laser current valueis measured that indicates that the laser is at the desired operatingtemperature.

Additional features and advantages will be set forth in the descriptionwhich follows, and in part will be obvious from the description, or maybe learned by the practice of the teaching herein. The features andadvantages of the teaching herein may be realized and obtained by meansof the instruments and combinations particularly pointed out in theappended claims. These and other features will become more fullyapparent from the following description and appended claims, or may belearned by the practice of the invention as set forth hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

To further clarify the above and other advantages and features of thepresent invention, a more particular description of the invention willbe rendered by reference to specific embodiments thereof which areillustrated in the appended drawings. It is appreciated that thesedrawings depict only illustrated embodiments of the invention and aretherefore not to be considered limiting of its scope. The invention willbe described and explained with additional specificity and detailthrough the use of the accompanying drawings in which:

FIG. 1A is a perspective view of an example of an optical transceivermodule;

FIG. 1B is a simplified block view showing various aspects of theoptical transceiver module of FIG. 1A;

FIG. 2 schematically illustrates an example of the control module ofFIG. 1B;

FIG. 3 schematically illustrates an example TOSA including a laser and aheating resistor;

FIG. 4 schematically illustrates a portion of an optical transceivermodule;

FIG. 5 illustrates a plot showing heater current versus temperature; and

FIG. 6 illustrates a flow chart of a method for controlling thetemperature of a laser in accordance with embodiments disclosed herein.

DETAILED DESCRIPTION

The principles of the present invention provide for a closed loop systemfor controlling laser temperature without the need for additionalsensors or other hardware. Embodiments utilize an existing automaticpower feedback loop and existing sensors to determine the temperature ofa TOSA based on changes in laser bias current, thus avoiding the needfor the additional hardware. The automatic power feedback loop willmodify the laser bias current as the temperature of the TOSA changes.That is, as the temperature increases, the amount of laser bias currentis increased and as the temperature decreases, the amount of laser biascurrent is decreased. Thus, the laser bias current may be used asfeedback for the laser temperature control. Accordingly, when thetransceiver module drops below a predetermined temperature, a laserheater current may be controlled to thereby maintain the same laser biascurrent as at the preset temperature.

Reference is first made to FIG. 1A, which depicts a perspective view ofan example optical transceiver module (“transceiver”), generallydesignated at 100, for use in transmitting and receiving optical signalsin connection with an external host that is operatively connected, inone embodiment, to a communications network. As shown, the transceivershown in FIG. 1 includes various components, including a ReceiverOptical Subassembly (“ROSA”) 10, a Transmitter Optical Subassembly(“TOSA”) 20, electrical interfaces 30, various electronic components 40,such as a laser-driver/post-amplifier and a control module for example,and a printed circuit board 50 which supports the electronic components40.

In the illustrated embodiment, two electrical interfaces 30 are includedin the transceiver 100, one each used to electrically connect the ROSA10 and the TOSA 20 to a plurality of conductive pads located on the PCB50. The electronic components 40 are also attached to the PCB 50. Anedge connector 60 is located on an end of the PCB 50 to enable thetransceiver 100 to electrically and mechanically interface with a host(not shown). In addition, the above-mentioned components of thetransceiver 100 are partially housed within a housing 70. Though notshown, some embodiments include a shell that cooperates with the housing70 to define an enclosure for components of the transceiver 100.

Reference is now made to FIG. 1B, which is a simplified block diagram ofan example of an optical transceiver, denoted at 100 in FIG. 1A,depicting various physical and operational aspects of the transceiver.While the optical transceiver 100 will be described in some detail, theoptical transceiver 100 is described by way of illustration only, andnot by way of restricting the scope of the invention. As mentionedabove, the optical transceiver 100 in one embodiment is suitable foroptical signal transmission and reception at a variety of per-seconddata rates, including 1 Gbit/s, 2 Gbit/s, 4 Gbit/s, 10 Gbit/s, 40gbit/s, 10 Gbit/s as well as even higher data rates. Furthermore, theembodiments described herein can be implemented in optical transceiversconforming with any of a variety of different form factors, examples ofwhich include, but are not limited to, XFP, SFP and SFF, as well as avariety of different communication protocols, examples of which include,but are not limited to, GiGE, SONET, and Fibre Channel.

With continuing reference to FIG. 1B, and with reference as well to FIG.1A, transceiver 100 includes printed circuit board (“PCB”) 50 on whichthe various electronic components of the transceiver are mounted. Onesuch component is a control module 105. Control module 105 is connectedto an integrated post-amplifier/laser driver (“PA/LD”) 102 byconnections 105A and 105B. These connections allow control module 105 tomonitor the operation of the post-amplifier/laser driver 102 as will bedescribed in more detail to follow. Control module 105 is connected to apersistent memory 106, which stores microcode for configuring controlmodule 105 and is also used to store operational parameters. The controlmodule 105 is also able to communicate with an external host 111 asdepicted by the Serial Data line (SDA) and Serial Clock line (SCL).

Transceiver 100 includes both a transmit path and a receive path, bothof which will now be described. The receive path includes ROSA 10, whichincludes a photodiode that transforms an incoming optical data signalinto an electrical data signal. The electrical data signal is thenprovided to a post-amplifier portion of PA/LD 102. The post-amplifieramplifies and otherwise processes the electrical data signal andprovides the electrical data signal to the external host 111 viaconnection 102A.

For the transmit path, external host 111 generates an electrical datasignal and provides the electrical data signal to a laser driver portionof PA/LD 102 via connection 102B. The laser driver processes theelectrical data signal and drives the TOSA 20, which causes a laserincluded in the TOSA 20 to emit an optical data signal.

The operation of transceiver 100 will now be described in furtherdetail. In operation, the optical transceiver 100, receives an opticaldata signal from a fiber 110A via the ROSA 10. The ROSA 10 transformsthe received optical data signal into an electrical data signal. TheROSA 10 then provides the resulting electrical data signal to apost-amplifier. In the illustrated embodiment, the post amplifier isconsolidated with the laser driver as an integrated PA/LD 102. As such,the PA/LD 102 resides on a single integrated circuit chip and isincluded as a component, together with the other electronic components40, some of which are further described below, on PCB 50. In otherembodiments, the post amplifier and laser driver are implemented asseparate components on the PCB 50.

The post-amplifier portion of the PA/LD 102 amplifies the receivedelectrical data signal and provides the amplified data signal toexternal host 111 over signal path 102A. The external host 111 may beany computing system capable of communicating with the opticaltransceiver 100. The external host 111 contains a host memory 112 thatmay be any volatile or non-volatile memory source. In one embodiment,some components of the optical transceiver 100 can reside on the host111 while the other components of the transceiver reside on the PCB 50separate from the host 111.

The optical transceiver 100 may also receive electrical data signalsfrom the host 111 for transmission onto a fiber 10B. Specifically, thelaser driver portion of the PA/LD 102 receives the electrical datasignal from the host 111 via the signal path 102B, and drives the laseror light source within the TOSA 20. One example of a light source is aDML or a VCSEL that causes the TOSA 20 to emit onto the fiber 110Boptical data signals representative of the information in the electricaldata signal provided by the host 111.

The behavior of the ROSA 10, the PA/LD 102, and the TOSA 20 may varydynamically due to a number of factors. For example, temperaturechanges, power fluctuations, and feedback conditions may each affect theperformance of these components. Accordingly, the transceiver 100includes a control module 105, which may evaluate environmentalconditions, such as temperature, age of the laser, and/or operatingconditions, such as voltage or bias current, and receive informationfrom the post-amplifier portion of the PA/LD 102 by way of connection105A, and from the laser driver portion of the PA/LD by way ofconnection 105B. This arrangement allows the control module 105 tooptimize the performance of the laser to compensate for dynamicallyvarying conditions.

Specifically, the control module 105 optimizes the operation of thetransceiver 100 by adjusting settings on the PA/LD 102 as represented bythe connections 105A and 105B. These settings adjustments can beintermittent and are generally only made when temperature or voltage orother low frequency changes so warrant. For example, the control modulemay include sensors that allow it to monitor and measure the laser biascurrent provided by the laser driver portion of PA/LD 102. In someembodiments, the control module may include an analog-to-digitalconverter (ADC) that would allow it to receive analog signals from thelaser driver portion of PA/LD 102 and then convert these signals todigital signals. This allows control module 105 to use connection 105Bto direct the laser driver portion of PA/LD 102 to adjust the laser biascurrent up or down as needed.

The control module 105 has access to a persistent memory 106, which inone embodiment, is an Electrically Erasable and Programmable Read OnlyMemory (EEPROM). Persistent memory 106 may also be any othernon-volatile memory source. Persistent memory 106 is used to storemicrocode for configuring control module 105 and for storing operationalparameters that have been measured by the control module 105. Thepersistent memory 106 and the control module 105 may be packagedtogether in the same package or in different packages withoutrestriction.

Data and clock signals may be provided from the host 111 to the controlmodule 105 using the SDA and SCL lines respectively. Also data may beprovided from the control module 105 to the host 111 to allow fortransmitting diagnostic data such as environmental and/or operationalparameters. The control module 105 includes both an analog portion 108and a digital portion 109. In this example, the analog portion 108 andthe digital portion 109 collectively enable the control module toimplement logic digitally, while still largely interfacing with the restof the optical transceiver 100 using analog signals.

FIG. 2 schematically illustrates an example 200 of the control module105A in further detail. The control module 200 includes an analogportion 200A that represents an example of the analog portion 108 ofFIG. 1, and a digital portion 200B that represents an example of thedigital portion 109 of FIG. 1.

For example, the analog portion 200A may contain digital to analogconverters, analog to digital converters, high speed comparators (e.g.,for event detection), voltage based reset generators, voltageregulators, voltage references, clock generator, and other analogcomponents. For example, the analog portion 200A includes sensors 211A,211B, 211C amongst potentially others as represented by the horizontalellipses 211D. Each of these sensors may be responsible for measuringoperational parameters that may be measured from the control module 200such as, for example, supply voltage, bias current or voltage, andtransceiver temperature. The control module may also receive externalanalog or digital signals from other components within the opticaltransceiver that indicate other measured parameters such as, forexample, laser bias current, transmit power, receive power, laserwavelength, laser temperature, and Thermo Electric Cooler (TEC) current.Two external lines 212A and 212B are illustrated for receiving suchexternal analog signals although there may be many of such lines.

The internal sensors may generate analog signals that represent themeasured values. In addition, the externally provided signals may alsobe analog signals. In this case, the analog signals are converted todigital signals so as to be available to the digital portion 200B of thecontrol module 200 for further processing. Of course, each analogparameter value may have its own Analog to Digital Converter (ADC).However, to preserve chip space, each signal may be periodically sampledin a round robin fashion using a single ADC such as the illustrated ADC214. In this case, each analog value may be provided to a multiplexer213, which selects in a round robin fashion, one of the analog signalsat a time for sampling by the ADC 214. Alternatively, multiplexer 213may be programmed to allow any order of analog signals to be sampled byADC 214.

As previously mentioned, the analog portion 200A of the control module200 may also include other analog components 215 such as, for example,digital to analog converters, other analog to digital converters, highspeed comparators (e.g., for event detection), voltage based resetgenerators, voltage regulators, voltage references, clock generator, andother analog components.

The digital portion 200B of the control module 200 may include a timermodule 202 that provides various timing signals used by the digitalportion 200B. Such timing signals may include, for example, programmableprocessor clock signals. The timer module 202 may also act as a watchdogtimer.

Two general-purpose processors 203A and 203B are also included. Theprocessors recognize instructions that follow a particular instructionset, and may perform normal general-purpose operation such as shifting,branching, adding, subtracting, multiplying, dividing, Booleanoperations, comparison operations, and the like. In one embodiment, thegeneral-purpose processors 203A and 203B are each a 16-bit processor andmay be identically structured. The precise structure of the instructionset is not important to the principles of the present invention as theinstruction set may be optimized around a particular hardwareenvironment, and as the precise hardware environment is not important tothe principles of the present invention.

A host communications interface 204 is used to communicate with thehost, possibly implemented using a two-wire interface such as I²C shownin FIG. 1 as the serial data (SDA) and serial clock (SCL) lines on theoptical transceiver 10A. Other host communication interfaces may also beimplemented as well. Data may be provided from the control module 105Ato the host using this host communications interface to allow fordigital diagnostics and readings of temperature levels,transmit/receiver power levels, and the like. The external deviceinterface 205 is used to communicate with, for example, other moduleswithin the optical transceiver 100A such as, for example, thepost-amplifier 102A, the laser driver 103A, or the persistent memory106A.

The internal controller system memory 206 (not to be confused with theexternal persistent memory 106A) may be Random Access Memory (RAM) ornon-volatile memory. The memory controller 207 shares access to thecontroller system memory 206 amongst each of the processors 203A and203B and with the host communication interface 204 and the externaldevice interface 205. In one embodiment, the host communicationinterface 204 includes a serial interface controller 201A, and theexternal device interface 205 includes a serial interface controller201B. The two serial interface controllers 201A and 201B may communicateusing a two-wire interface such as I²C or another interface so long asthe interface is recognized by both communicating modules. One serialinterface controller (e.g., serial interface controller 201B) is amaster component, while the other serial interface controller (e.g.,serial interface controller 201A) is a slave component.

An input/output multiplexer 208 multiplexes the various input/outputpins of the control module 200 to the various components within thecontrol module 200. This enables different components to dynamicallyassign pins in accordance with the then existing operationalcircumstances of the control module 200. Accordingly, there may be moreinput\output nodes within the control module 200 than there are pinsavailable on the control module 200, thereby reducing the footprint ofthe control module 200.

Register sets 209 contain a number of individual registers. Theseregisters may be used by the processors 203 to write microcode generateddata that controls high speed comparison in optical transceiver 10A.Alternatively, the registers may hold data selecting operationalparameters for comparison. Additionally, the registers may be memorymapped to the various components of optical transceiver 100A forcontrolling aspects of the component such as laser bias current ortransmit power.

Returning again to FIG. 1B, in some embodiments the TOSA 20 may includea heating element 21 that is configured to provide heat to the laserinside TOSA 20. As will be described in more detail to follow, thecontrol module may control the amount of current provided to the heatingelement 21 via connection 105C. In some embodiments, the heating element21 may be a heating resistor, while in other embodiments the heatingelement may be any other suitable heating device or circuit configuredto heat a laser diode.

FIG. 3 illustrates in more detail an embodiment of a TOSA, generallydesignated at 300, that includes a heating resistor. The TOSA 300includes a laser 302. The laser 302 may be, for example, a distributedfeedback (DFB) laser, an electro-absorption modulated laser (EML), avertical cavity surface emitting laser (VCSEL) or other suitable opticaldevice.

The laser 302 is mounted on a substrate 304. The substrate 304 is usablein creating a submount including the laser 302. The submount can beincluded in a TO can package illustrated at 306. The substrate 304 maybe, for example, a ceramic substrate, silicon nitride substrate, asilicon dioxide substrate, or any other suitable substrate.

FIG. 3 further illustrates a heating resistor 308. The heating resistor308 may be any suitable resistor. In one embodiment, the heatingresistor 308 may be a thin-film resistor printed onto the substrate 304.For example, the thin film resister may be printed onto the substrateduring a process for printing other traces and pads onto the substrate304. In an alternative embodiment, the heating resistor may be a surfacemount component. In yet another alternative embodiment, the heatingresistor could be monolithically integrated with the laser itself.

Other embodiments may use other suitable components. In one particularembodiment, the heating resistor may be configured to be in the 5 to 100Ohm range, preferably 15 Ohms, when used with a 3V power source. Thisprovides power dissipation of about 90-900 mW. In particular, it hasbeen noted that in some embodiments, a 1° C. temperature rise can beobtained for every 10 mW of electrical power generated by the heatingresistor 308. Thus, using 300 mW, the operating temperature of the laser302 can be raised 30° C. Thus, in an embodiment where the laser isoptimized for −10° C. to 90° C., a TOSA 300 can be implemented thatoperates from −40° C. to 90° C. by activating the heating resistor 308when ambient temperatures are below −10° C. Power dissipation of theheating resistor 308 can be controlled such that an appropriatetemperature change is achieved as will be described in more detail tofollow.

As described above, an optical transceiver module such as transceiver100 is susceptible to changes in its operating environment. For example,as the temperature of the transceiver changes, the operation of thelaser in TOSA 20 will change. That is, when the temperature falls, lesslaser bias current is needed to maintain a desired optical output powerlevel while more laser bias current is needed when the temperature risesto maintain the desired optical output power level. Accordingly, it iscommon for optical transceiver modules to implement an automatic powerfeedback loop that forces the laser bias current to adjust with changesin temperature. The transceiver is calibrated so that the laser biascurrent for a given temperature over a range of temperatures isascertained. This information is then made available to the automaticpower feedback loop. The automatic power feedback loop, which includesthe control module 105 and the laser driver, constantly monitors thetemperature. When the temperature changes, the control module causes thelaser driver to adjust the laser bias current to a level thatcorresponds to the given temperature. In this way, a constant opticaloutput power is achieved regardless of temperature.

In some applications, it is often necessary or desirable to operate thetransceiver module 100 at a temperature that is lower than thetemperature rating of the laser implemented in the module. For example,in some embodiments the laser may be optimized for −10° C. to 90° C.,while the optical module needs to operate at −40° C. to 90° C. In suchcircumstances, a heater such as heater 21 may be implemented to ensurethat the laser's temperature is maintained at an acceptable level.

However, when implementing the heater 21, it may be necessary to providecurrent control for the heater. Several different solutions have beenimplemented. For example, one solution has been to place a temperaturesensor in the TOSA 20 and then to build a table of heater current vs.TOSA temperature. Another solution has been to run an open feedback loopsystem that builds a heater current versus case temperature table. Asthe temperature changes, the current to the heater is adjusted. Whileboth of these methods have proven useful, they require that anadditional sensor such as a thermistor be implemented with the laser.Implementing the thermistor can be expensive and difficult to implement.

Other solutions include using a wavelength locker such as are used inDWDM system. However, such systems are also not ideal as wavelengthlockers are very expensive.

Advantageously, the principles of the present invention provide for aclosed loop system for controlling the laser temperature without theneed for additional sensors or other hardware. Embodiments of thepresent invention utilize the existing automatic power feedback loop andexisting sensors to determine the temperature of a TOSA, based onchanges in laser bias current, thus avoiding the need for the additionalhardware. As mentioned previously, the automatic power feedback loopwill modify the laser bias current as the temperature of the TOSAchanges. That is, as the temperature increases, the amount of laser biascurrent is increased and as the temperature decreases, the amount oflaser bias current is decreased. Thus, the laser bias current may beused as feedback for the laser temperature control. Accordingly, whenthe transceiver module drops below a preset temperature, the laserheater current may be controlled to maintain the same laser bias currentas at the preset temperature.

Reference is now made to FIG. 4, which illustrates a portion of atransceiver module 400, which may correspond to the module 100. Asshown, the module 400 includes a heater 405, a laser 410, a sensor 415,a control module 420, and a power supply 425.

The sensor 415 may correspond to the sensors 211 which reside in thecontrol module, or it may correspond to a sensor that is placedelsewhere in the transceiver module, such as in the laser driver portionof PA/LD 102 or in the TOSA 20. In operation, the sensor 415 isconfigured to measure the bias current value provided by the automaticpower feedback loop to the laser 410 when the laser is at 25 degreesCelsius. This value is then recorded in a memory such as persistentmemory 106 that is accessible by the control module 420. Although 25degrees Celsius (i.e., room temperature) will be used in the exampleembodiment, it will be appreciated that the laser bias current may bemeasured and recorded for any desired temperature

The sensor 415 continues to monitor the laser bias current beingprovided to the laser 410. As mentioned, as the temperature begins tochange so will the bias current. The sensor 415 may notify the controlmodule 420 when the laser bias current has changed. The control module420, which may correspond to the control module 200, may then determineif the laser bias current has fallen below the laser bias value recordedat 25 degrees Celsius.

As illustrated, the control module 420 powers the heater 405 from thepower supply 425. When the control module 420 determines that the laserbias current has fallen below the laser bias current measured andrecorded at 25 degrees Celsius, thus indicating that the temperature ofthe TOSA has fallen, the control module sends current to or turns on theheater 405. As described above, the heater 405, which may correspond tothe resistor heater 308, is configured to heat the laser 410. As will beappreciated, as the current that is provided to the heater 405increases, the amount of heat it provides to laser 410 will alsoincrease. Thus, for lower temperatures, a greater amount of current isneeded by heater 405 in order to maintain a desired temperature, such as25 degrees Celsius. This is further illustrated in FIG. 5, which showsheater current versus temperature. As the temperature decreases, theamount of heater current needed for the heater to maintain 25 degreesCelsius increases.

As the temperature of the laser increases, the automatic power feedbackloop will begin to increase the laser bias current. In turn, this willbe detected by sensor 415 and provided to control module 420. When thelaser bias current is again at the 25 degrees Celsius value, the controlmodule 420 will cause that the current level being provided to heater405 is maintained to thereby maintain the laser bias current at the 25degrees Celsius level.

This process will continually be repeated throughout operation of thetransceiver module 400. Anytime that a change in laser bias currentdetected by sensor 415 indicates that the temperature has fallen, thecontrol module 420 will cause that the current being provided the heater405 is increased until the laser bias current returns to its value at 25degrees Celsius, thus indicating that the laser is likely at roomtemperature. Likewise, if a change in laser bias current detected bysensor 415 indicates that the temperature has increased, the controlmodule 420 will cause that the current being provided the heater 405 isdecreased until the laser bias current returns to its value at 25degrees Celsius. It will appreciated that if the sensors 415 and thecontrol module 420 determine that the laser bias current is above the 25degrees Celsius value, then the control module 420 will cause thatcurrent to the heater 405 is turned off as the laser will not need to beheated.

Accordingly, the principles of the present invention enable a laser tooperate while the temperature of the module drops below the normaloperating temperature of the laser. For example, a VCSEL normallyoperates to specification down to about −10 degrees Celsius. However,with the heater and control of the present invention, the VCSEL may beused in a transceiver module that operates at about −40 degrees Celsius.In addition, since there is some yield loss in many lasers while testingfor low temperature performance (<10 degrees Celsius), the principles ofthe present invention improves yield of lasers for acceptable moduleuse. Further, the power efficiency of a transceiver module isindependent of the heater value because the heating current is limitedby the controller as explained.

Attention is now made to FIG. 6, which illustrates a method 600 for anoptical transceiver to control the temperature of a laser. The methodwill be described in relation to FIGS. 1, 2, 3, and 4. Of course, one ofskill in the art will appreciate that method 600 may be performed innumerous other environments as circumstances warrant.

Method 600 includes determining 602 that a laser bias current providedto a laser is less than a predetermined value, wherein the laser biascurrent is indicative of laser temperature and the predetermined laserbias current value is indicative of a desired operating temperature. Forexample, as previously described, the sensor 415 and the control module420 may determine the laser bias current value at a desired operatingtemperature such as 25 degrees Celsius. This value may then be stored inpersistent memory 106. Thus, the bias current value at 25 degreesCelsius is indicative of that temperature. As mentioned previously, thebias current may act as a feedback to control temperature as thus isindicative of the laser temperature.

The method 600 also includes adjusting 602 an amount of current providedto a heating element configured to heat the laser. As described, whenthe sensor 415 and the control module 420 determine that the laser biascurrent has fallen below the predetermined value, the control module 420may cause that current is provided to the heater 405. The amount ofcurrent provided will depend on the module temperature. The adjusting ofthe current provided to the heating element will continue until it isdetermined that the laser bias current is at the predetermined value, atwhich time the control module will hold the current constant untilanother change in the laser bias current is measured.

This process will continually be repeated throughout operation of thetransceiver module 400. Anytime that a change in laser bias currentdetected by sensor 415 indicates that the temperature has fallen, thecontrol module 420 will cause that the current being provided the heater405 is increased until the laser bias current returns to its value at 25degrees Celsius, thus indicating that the laser is likely at roomtemperature. Likewise, if a change in laser bias current detected bysensor 415 indicates that the temperature has increased, the controlmodule 420 will cause that the current being provided the heater 405 isdecreased until the laser bias current returns to its value at 25degrees Celsius. It will appreciated that if the sensors 415 and thecontrol module 420 determine that the laser bias current is above the 25degrees Celsius value, then the control module 420 will cause thatcurrent to the heater 405 is turned off as the laser will not need to beheated.

Although the embodiments previously described have indicated that thelaser bias current generally goes down with laser temperature going downand vice versa, this need not always be the case. As will beappreciated, as long as the relationship between laser temperature andlaser bias current is predictable and monolithic, then the principles ofthe present invention are applicable. That is as long as the lasertemperature changes in a predictable manner with changes in laser biascurrent, then the laser bias current may be used as feedback that isindicative of the laser temperature.

Accordingly, in one embodiment the control module 420 may be configuredto ascertain a relationship between the temperature of laser 410 and thelaser bias current that is provided to the laser. The relationship maycorrespond to the relationship previously described in that the laserbias current generally goes down with laser temperature going down.However, the relationship may be the opposite in that the laser biascurrent will generally go down as laser temperature going up. One ofskill in the art will appreciate that any relationship between laserbias current and laser temperature is contemplated by the principles ofthe present invention.

Once the relationship is known, then the temperature of the laser 410may be ascertained by measuring the bias current with the sensor 415.That is, the control module 420 is able to determine the currenttemperature of the laser based on the laser current bias value. If thelaser bias current value indicates that the laser 410 temperature is notat a desired temperature, the control module may cause that current beprovided to the heater 405 or that current being provided to the heateris adjusted or turned off until a laser bias current value is measuredthat corresponds to or is indicative of the desired laser operatingtemperature. As will be appreciated, as the temperature of the laser 410changes, the amount of laser bias current being provided will change inaccordance with the relationship between the laser temperature and thelaser bias current. In the way, the laser bias current may be used toset the laser temperature.

Embodiments include general-purpose and/or special-purpose devices orsystems that include both hardware and/or software components.Embodiments may also include physical computer-readable media and/orintangible computer-readable media for carrying or havingcomputer-executable instructions, data structures, and/or data signalsstored thereon. Such physical computer-readable media and/or intangiblecomputer-readable media can be any available media that can be accessedby a general purpose or special purpose computer. By way of example, andnot limitation, such physical computer-readable media can include RAM,ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storageor other magnetic storage devices, other semiconductor storage media, orany other physical medium which can be used to store desired data in theform of computer-executable instructions, data structures and/or datasignals, and which can be accessed by a general purpose or specialpurpose computer. Within a general purpose or special purpose computer,intangible computer-readable media can include electromagnetic means forconveying a data signal from one part of the computer to another, suchas through circuitry residing in the computer.

When information is transferred or provided over a network or anothercommunications connection (either hardwired, wireless, or a combinationof hardwired and wireless) to a computer, hardwired devices for sendingand receiving computer-executable instructions, data structures, and/ordata signals (e.g., wires, cables, optical fibers, electronic circuitry,chemical, and the like) should properly be viewed as physicalcomputer-readable mediums while wireless carriers or wireless mediumsfor sending and/or receiving computer-executable instructions, datastructures, and/or data signals (e.g., radio communications, satellitecommunications, infrared communications, and the like) should properlybe viewed as intangible computer-readable mediums. Combinations of theabove should also be included within the scope of computer-readablemedia.

Computer-executable instructions include, for example, instructions,data, and/or data signals which cause a general purpose computer,special purpose computer, or special purpose processing device toperform a certain function or group of functions. Although not required,aspects of the invention have been described herein in the generalcontext of computer-executable instructions, such as program modules,being executed by computers, in network environments and/or non-networkenvironments. Generally, program modules include routines, programs,objects, components, and content structures that perform particulartasks or implement particular abstract content types.Computer-executable instructions, associated content structures, andprogram modules represent examples of program code for executing aspectsof the methods disclosed herein.

Embodiments may also include computer program products for use in thesystems of the present invention, the computer program product having aphysical computer-readable medium having computer readable program codestored thereon, the computer readable program code comprising computerexecutable instructions that, when executed by a processor, cause thesystem to perform the methods of the present invention.

The present invention may be embodied in other specific forms withoutdeparting from its spirit or essential characteristics. The describedembodiments are to be considered in all respects only as illustrativeand not restrictive. The scope of the invention is, therefore, indicatedby the appended claims rather than by the foregoing description. Allchanges which come within the meaning and range of equivalency of theclaims are to be embraced within their scope.

1. An optical transceiver module comprising: a module housing; a printedcircuit board at least partially positioned inside the module housing; areceiver optical subassembly (ROSA) at least partially positioned insidethe module housing; and a transmitter optical subassembly (TOSA) atleast partially positioned inside the module housing, the TOSAcomprising: a TOSA package; a laser positioned inside the TOSA package;a sensor configured to monitor an amount of laser bias current providedto the laser without directly monitoring the temperature of any portionof the optical transceiver module; a heating element positioned insidethe TOSA package and configured to heat the laser; and control circuitrycoupled to the heating element and the sensor, wherein the controlcircuitry is configured to: determine a relationship between thetemperature of the laser and the laser bias current provided to thelaser, adjust an amount of current provided to the heating element whena reading from the sensor indicates that the laser bias current beingprovided to the laser is below a value that the temperature to biascurrent relationship associates with a desired temperature, and adjustthe amount of current provided to the heating element without input froma temperature sensor that directly monitors the temperature of at leasta portion of the optical transceiver module, and wherein providingcurrent to the heating element causes a change in the operatingtemperature of the laser.
 2. The optical transceiver in accordance withclaim 1, wherein the laser is disposed on a substrate that is positionedinside the TOSA package and the heating element is disposed on thesubstrate with the laser.
 3. The optical transceiver in accordance withclaim 1, wherein the heating element comprises at least one of a printedfilm resistor, a surface mount resistor, or a resistor monolithicallyintegrated with the laser.
 4. The optical transceiver in accordance withclaim 3, wherein the heating element is a resistor between 5 and 100Ohms.
 5. The optical transceiver in accordance with claim 1, wherein thesensor is included within the control circuitry.
 6. The opticaltransceiver in accordance with claim 1, wherein the laser comprises avertical cavity surface emitting laser (VCSEL).
 7. The opticaltransceiver in accordance with claim 1, wherein the control circuitry isfurther configured to not cause current to be provided to the heatingelement when the sensor determines that the laser bias current beingprovided to the laser is above the value associated with the desiredtemperature.
 8. The optical transceiver in accordance with claim 1,wherein the control circuitry continues to adjust the amount of currentprovided to the heating element as long as the bias current is below thevalue associated with the desired temperature, wherein more current isprovided to the heating element the farther the laser bias current isfrom the value associated with the desired temperature.
 9. A method foran optical transceiver to control the temperature of a laser, the methodcomprising: determining a relationship between the temperature of thelaser that is positioned inside a TOSA package and a laser bias currentprovided to the laser; determining that a laser bias current provided toa laser is less than a value that the temperature to bias currentrelationship associates with a desired operating temperature; andadjusting an amount of current provided to a heating element that ispositioned inside the TOSA package with the laser and that is configuredto heat the laser based on the determination that the laser bias currentis less than the value associated with the desired operating temperatureand not based on a direct monitoring of the temperature of at least aportion of the optical transceiver module.
 10. The method in accordancewith claim 9, wherein adjusting an amount of current provided to aheating element comprises: determining that a change in the laser biascurrent provided to the laser is indicative of a fall in moduletemperature; and in response, increasing the amount of current providedto the heating element, the increase in current causing the heatingelement to heat the laser.
 11. The method in accordance with claim 9,wherein adjusting an amount of current provided to a heating elementcomprises: determining that a change in the laser bias current providedto the laser is indicative of a rise in module temperature; and inresponse, decreasing the amount of current provided to the heatingelement.
 12. The method in accordance with claim 9, wherein adjusting anamount of current provided to a heating element comprises: adjusting thecurrent provided to the heating element until it is determined that thelaser bias current is at the value associated with the desired operatingtemperature.
 13. The method in accordance with claim 9, wherein thelaser is disposed on a substrate that is positioned inside the TOSApackage and the heating element is disposed on the substrate with thelaser.
 14. The method in accordance with claim 13, wherein the heatingelement comprises at least one of a printed film resistor, a surfacemount resistor, or a resistor monolithically integrated with the laser.15. The method in accordance with claim 9, wherein the sensor isincluded within a control module configured to adjust the amount ofcurrent provided to the heating element.
 16. The method in accordancewith claim 9, wherein the laser comprises a vertical cavity surfaceemitting laser (VCSEL).
 17. An optical transceiver module comprising: amodule housing; a printed circuit board at least partially positionedinside the module housing; a receiver optical subassembly (ROSA) atleast partially positioned inside the module housing; and a transmitteroptical subassembly (TOSA) at least partially positioned inside themodule housing, the TOSA comprising: a TOSA package; a laser positionedinside the TOSA package; a sensor configured to monitor an amount oflaser bias current provided to the laser without directly monitoring thetemperature of any portion of the optical transceiver module; a heatingelement positioned inside the TOSA package and configured to heat thelaser; a control module coupled to the heating element and the sensor,wherein the control module is configured to: determine a relationshipbetween the temperature of the laser and a laser bias current that isprovided to the laser; determine that the laser is not at a desiredoperating temperature based solely on a measured laser bias currentvalue from the sensor and the relationship between the temperature ofthe laser and laser bias current that is provided to the laser and notbased on a direct monitoring of the temperature of at least a portion ofthe optical transceiver module; and cause that a current to the heatingelement be adjusted to thereby change the temperature of the laser untila laser bias current value is measured that indicates that the laser isat the desired operating temperature.
 18. The optical transceiver inaccordance with claim 17, wherein the laser is disposed on a substratethat is positioned inside the TOSA package and the heating element isdisposed on the substrate with the laser.
 19. The optical transceiver inaccordance with claim 18, wherein the heating element comprises at leastone of a printed film resistor, a surface mount resistor, or a resistormonolithically integrated with the laser.
 20. The optical transceiver inaccordance with claim 17, wherein the sensor is included within thecontrol module.